From now  on Diamond Product Solutions can polish 4"diameter diamond coated Silicon wafers.

A diamond coating, thickness from 25 micron up to 300 micron can be grown on a 4 mm thick Silicon wafer.

Diameters  from 25 mm up to 100 mm, and in the near future  150 - 200 mm in diameter. This  rather rough diamond coating has  a perfect adhesion to the Silicon wafer.  This  diamond coating is  then being polished to a flatness < 2 micron over  100 mm, and a roughness of < 3 nm.

Then this product can be used by customers for there thermal solutions , and or  elektroncal applications.

Diamond Product Solutions also transferes the complete technology for able to polish there own diamond coated Si wafers , to customers. It is  a turn key system inclusive machines, jigging and training .